Semiconductor memory device

ABSTRACT

According to one embodiment, a semiconductor memory device includes first and second memory cells, a first word line, first and second sense amplifiers, first and second bit lines, a controller. The first and second sense amplifiers each include first and second transistors. The first bit line is connected between the first memory cell and the first transistor. The second bit line is connected between the second memory cell and the second transistor. In the read operation, the controller is configured to apply a kick voltage to the first word line before applying the read voltage to the first word line, and to apply a first voltage to a gate of the first transistor and a second voltage to a gate of the second transistor while applying the kick voltage to the first word line.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims benefit under 35 U.S.C.§ 120 to U.S. application Ser. No. 17/807,034, filed Jun. 15, 2022,which is a continuation of and claims benefit under 35 U.S.C. § 120 toU.S. application Ser. No. 17/230,411, filed Apr. 14, 2021 (now U.S. Pat.No. 11,393,545), which is a continuation of and claims benefit under 35U.S.C. § 120 to U.S. application Ser. No. 16/220,878, filed Dec. 14,2018 (now U.S. Pat. No. 11,011,241), which is a continuation of andclaims benefit under 35 U.S.C. § 120 to U.S. application Ser. No.15/886,464, filed Feb. 1, 2018 (now U.S. Pat. No. 10,204,692), which isbased upon and claims the benefit of priority under 35 U.S.C. § 119 fromJapanese Patent Application No. 2017-176641, filed on Sep. 14, 2017, theentire contents of each of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor memorydevice.

BACKGROUND

A NAND type flash memory as a semiconductor memory device is known.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating an example of a generalconfiguration of a semiconductor memory device according to a firstembodiment;

FIG. 2 is a circuit diagram illustrating a configuration example of amemory cell array included in the semiconductor memory device accordingto the first embodiment;

FIG. 3 is a diagram illustrating an example of a threshold distributionand a data allocation for memory cell transistors included in thesemiconductor memory device according to the first embodiment;

FIG. 4 is a block diagram illustrating a detailed configuration exampleof a row decoder module included in the semiconductor memory deviceaccording to the first embodiment;

FIG. 5 is a block diagram illustrating a detailed configuration exampleof a sense amplifier module and a voltage generator included in thesemiconductor memory device according to the first embodiment;

FIG. 6 is a block diagram illustrating a configuration example of thesense amplifier module included in the semiconductor memory deviceaccording to the first embodiment;

FIG. 7 is a diagram illustrating an example of a plane layout of thememory cell array included in the semiconductor memory device accordingto the first embodiment;

FIG. 8 is a cross-sectional view of the memory cell array taken alongline VIII-VIII illustrated in FIG. 7 ;

FIG. 9 is a diagram illustrating an example of a sectional structure ofthe memory cell array and the row decoder module included in thesemiconductor memory device according to the first embodiment;

FIG. 10 is a diagram illustrating an example of a sectional structure ofthe sense amplifier module included in the semiconductor memory deviceaccording to the first embodiment;

FIG. 11 is a table showing an example of a read operation in thesemiconductor memory device according to the first embodiment;

FIG. 12 is a diagram illustrating examples of waveforms in the readoperation in the semiconductor memory device according to the firstembodiment;

FIG. 13 is a diagram illustrating examples of the waveforms in the readoperation in a comparative example of the first embodiment;

FIG. 14 is a block diagram illustrating a detailed configuration exampleof a memory cell array and a row decoder module included in asemiconductor memory device according to a second embodiment;

FIG. 15 is a circuit diagram illustrating a configuration example of thesense amplifier module included in the semiconductor memory deviceaccording to the second embodiment;

FIG. 16 is a diagram illustrating an example of a sectional structure ofthe sense amplifier module included in the semiconductor memory deviceaccording to the second embodiment;

FIG. 17 is a table showing an example of a read operation in thesemiconductor memory device according to the second embodiment;

FIG. 18 is a block diagram illustrating a detailed configuration exampleof a memory cell array and a row decoder module included in asemiconductor memory device according to a third embodiment;

FIG. 19 is a block diagram illustrating a detailed configuration exampleof a sense amplifier module and a voltage generator included in thesemiconductor memory device according to the third embodiment;

FIG. 20 is a table showing an example of a read operation in thesemiconductor memory device according to the third embodiment;

FIG. 21 is a diagram illustrating examples of waveforms in the readoperation in the semiconductor memory device according to the thirdembodiment;

FIG. 22 is a block diagram illustrating a detailed configuration exampleof a sense amplifier module and a voltage generator included in asemiconductor memory device according to a fourth embodiment;

FIG. 23 is a diagram illustrating an example of a sectional structure ofthe sense amplifier module included in the semiconductor memory deviceaccording to the fourth embodiment;

FIG. 24 is a diagram illustrating examples of waveforms in a readoperation in the semiconductor memory device according to the fourthembodiment;

FIG. 25 is a block diagram illustrating a detailed configuration exampleof a memory cell array and a row decoder module included in asemiconductor memory device according to a fifth embodiment;

FIG. 26 is a block diagram illustrating a detailed configuration exampleof a sense amplifier module and a voltage generator included in asemiconductor memory device according to a fifth embodiment;

FIG. 27 is a diagram illustrating examples of waveforms in a readoperation in the semiconductor memory device according to the fifthembodiment;

FIG. 28 is a block diagram illustrating a configuration example of thesense amplifier module included in the semiconductor memory deviceaccording to the sixth embodiment;

FIG. 29 is a table showing an example of a read operation in thesemiconductor memory device according to the sixth embodiment; and

FIG. 30 is a diagram illustrating examples of waveforms in a readoperation in the semiconductor memory device according to a modificationof the first embodiment.

DETAILED DESCRIPTION

A semiconductor memory device according to embodiments includes a firstmemory cell and a second memory cell, a first word line, a first senseamplifier and a second sense amplifier, a first bit line and a secondbit line, and a controller. The first word line is connected to thefirst and second memory cells. The first and second sense amplifiersinclude a first transistor and a second transistor, respectively. Thefirst bit line is connected between the first memory cell and the firsttransistor. The second bit line is connected between the second memorycell and the second transistor. The controller performs a readoperation. The controller is configured to apply, in the read operation,a kick voltage higher than a read voltage to the first word line beforeapplying the read voltage to the first word line, and applies a firstvoltage to a gate of the first transistor and a second voltage lowerthan the first voltage to a gate of the second transistor while applyingthe kick voltage to the first word line.

Hereinafter, embodiments will be described with reference to thedrawings. The drawings are schematic. In the following description, thesame reference signs denote constituent elements having substantiallythe same functions and configurations. Numeric characters after theletters constituting a reference sign, letters after the numericcharacters constituting a reference sign, and “under bar+letters”attached to the letters constituting a reference sign are referenced byreference signs containing the same letters, and are used to distinguishcomponents having a similar configuration. When the components denotedby the reference signs containing the same letters do not need to bedistinguished from each other, the components are referred to by thereference signs containing only the same letters or numeric characters.

[1] First Embodiment

A semiconductor memory device according to a first embodiment will bedescribed below.

[1-1] Configuration

[1-1-1] General Configuration of the Semiconductor Memory Device 10

FIG. 1 is a block diagram illustrating an example of a generalconfiguration of a semiconductor memory device according to the firstembodiment. As illustrated in FIG. 1 , the semiconductor memory device10 includes a memory cell array 11, row decoder modules 12A and 12B, asense amplifier module 13, an input/output circuit 14, a register 15, alogic controller 16, a sequencer 17, a ready/busy controller 18, and avoltage generator 19.

The memory cell array 11 includes blocks BLK0 to BLKn (n is a naturalnumber of 1 or larger). The block BLK is a set of a plurality ofnonvolatile memory cells associated with bit lines and word lines, andis, for example, a data erase unit. For example, a multi-level cell(MLC) method is adopted for the semiconductor memory device 10, enablingeach memory cell to store data of 2 or more bits.

The row decoder modules 12A and 12B can select a target block BLK toperform any of various operations based on block addresses held in anaddress register 15B. The row decoder modules 12A and 12B can transfer avoltage supplied by the voltage generator 19 to the selected block BLK.The row decoder modules 12A and 12B will be described below in detail.

The sense amplifier module 13 can output data DAT read from the memorycell array 11 to an external controller via the input/output circuit 14.The sense amplifier module 13 can transfer write data DAT received fromthe external controller via the input/output circuit 14, to the memorycell array 11.

The input/output circuit 14 can transmit and receive, for example,input/output signals I/O (I/O1 to I/O8) each with an 8-bit width to andfrom the external controller. For example, the input/output circuit 14transfers the write data DAT included in the input/output signal I/Oreceived from the external controller, to the sense amplifier module,and transmits the read data DAT transferred from the sense amplifiermodule 13, to the external controller.

The register 15 includes a status register 15A, an address register 15B,and a command register 15C. The status register 15A holds, for example,status information STS on the sequencer 17 and transfers the statusinformation STS to the input/output circuit 14 based on an indicationfrom the sequencer 17. The address register 15B holds addressinformation ADD transferred from the input/output circuit 14. A blockaddress, a column address, and a page address included in the addressinformation ADD are used by the row decoder module 12, the senseamplifier module 13, and the voltage generator 19, respectively. Thecommand register 15C holds a command CMD transferred from theinput/output circuit 14.

The logic controller 16 can control the input/output circuit 14 and thesequencer 17 based on various control signals received from the externalcontroller. The various control signals used include, for example, achip enable signal/CE, a command latch enable signal CLE, an addresslatch enable signal ALE, a write enable signal/WE, a read enablesignal/RE, and a write protect signal/WP. The signal/CE is a signal usedto enable the semiconductor memory device 10. The signal CLE is a signalnotifying the input/output circuit 14 that a signal input to thesemiconductor memory device 10 in parallel with the asserted signal CLEis the command CMD. The signal ALE is a signal notifying theinput/output circuit 14 that a signal input to the semiconductor memorydevice 10 in parallel with the asserted signal ALE is the addressinformation ADD. The signals/WE and/RE are signals that instruct theinput/output circuit 14, for example, to input and output theinput/output signals I/O. The signal/WP is a signal used to set thesemiconductor memory device 10 to a protect state, for example, when thesemiconductor memory device 10 is powered on and off.

The sequencer 17 can control operations of the semiconductor memorydevice 10 as a whole based on the command CMD held in the commandregister 15C. For example, the sequencer 17 controls the row decodermodule 12, the sense amplifier module 13, the voltage generator 19, andthe like to perform various operations such as a write operation and aread operation.

The ready/busy controller 18 can generate a ready/busy signal RBn basedon an operating state of the sequencer 17. The signal RBn is a signalnotifying the external controller whether the semiconductor memorydevice 10 is in a ready state where the semiconductor memory device 10accepts an instruction from the external controller or in a busy statewhere the semiconductor memory device 10 does not accept theinstruction.

The voltage generator 19 can generate desired voltages based on thecontrol of the sequencer 17 and supply the generated voltages to thememory cell array 11, the row decoder module 12, the sense amplifiermodule 13, and the like. For example, the voltage generator 19 appliesdesired voltages to a signal line corresponding to a selected word lineand to signal lines corresponding to unselected word lines based on pageaddresses held in the address register 15B.

[1-1-2] Configuration of the Memory Cell Array 11

FIG. 2 is a circuit diagram illustrating a configuration example of thememory cell array 11 included in the semiconductor memory device 10according to the first embodiment. FIG. 2 illustrates an example of adetailed circuit configuration in one block BLK in the memory cell array11. As illustrated in FIG. 2 , the block BLK includes, for example,string units SU0 to SU3.

Each of the string units SU includes a plurality of NAND strings NS. Theplurality of NAND strings NS are associated with bit lines BL0 to BLm (mis a natural number of 1 or larger), respectively. Each of the NANDstrings NS includes, for example, memory cell transistors MT0 to MT7 andselect transistors ST1 and ST2.

The memory cell transistor MT includes a control gate and a chargestorage layer and can store data in a nonvolatile manner. The memorycell transistors MT0 to MT7 included in each NAND string NS areconnected in series between a source of the select transistor ST1 and adrain of the select transistor ST2. Control gates of the memory celltransistors MT0 to MT7 included in the same block BLK are connectedcommonly to the word lines WL0 to WL7, respectively. A set of 1-bit datastored in a plurality of memory cell transistors MT connected to thecommon word line WL in each string unit SU is hereinafter referred to asa “page”. Therefore, if 2-bit data is stored in one memory celltransistor MT, a plurality of memory cell transistors MT connected tothe common word line WL in one string unit SU stores 2-page data.

The select transistors ST1 and ST2 are used to select one of the stringunits SU for any of various operations. Drains of the select transistorsST1 included in the NAND strings NS corresponding to the same columnaddress are connected commonly to the corresponding bit line BL. Gatesof the select transistors ST1 included in the string units SU0 to SU3are connected commonly to select gate lines SGD0 to SGD3, respectively.In the same block BLK, sources of the select transistors ST2 areconnected commonly to a source line SL, and gates of the selecttransistors ST2 are connected commonly to select gate line SGS.

In the above-described circuit configuration of the memory cell array11, the word lines WL0 to WL7 are provided for each block BLK. The bitlines BL0 to BLm are shared among a plurality of the blocks BLK. Thenumber of the string units SU included in each block BLK and the numbersof the memory cell transistors MT and select transistors ST1 and ST2included in each NAND string NS are only illustrative and may beoptionally designed to have any values. The numbers of the word lines WLand select gate lines SGD and SGS are varied based on the numbers of thememory cell transistors MT and select transistors ST1 and ST2.

In the above-described circuit configuration of the memory cell array11, a threshold distribution formed by threshold voltages of a pluralityof memory cell transistors MT connected to the common word line WL inone string unit SU is, for example, as illustrated in FIG. 3 . FIG. 3illustrates an example of a threshold distribution, a read voltage, anddata allocation obtained when one memory cell transistor MT stores 2-bitdata. An axis of ordinate corresponds to the number of memory celltransistors MT, and an axis of abscissas corresponds to a thresholdvoltage Vth of each memory cell transistor MT.

As illustrated in FIG. 3 , a plurality of memory cell transistors MTforms four threshold distributions based on the stored 2-bit data. Thefour threshold distributions are referred to as an “ER” level, an “A”level, a “B” level, and a “C” level in the order of increasing thresholdvoltage. In the MLC method, for example, “10 (lower, upper)” data, “11”data, “01” data, and “00” data are assigned to the “ER” level, the “A”level, the “B” level, and the “C” level, respectively.

In the above-described threshold distributions, read voltages are eachset between the adjacent threshold distributions. For example, a readvoltage AR is set between the maximum threshold voltage at the “ER”level and the minimum threshold voltage at the “A” level and used for anoperation of determining whether the threshold voltage of the memorycell transistor MT is included in the threshold distribution at the “ER”level or in the threshold distribution at the “A” level or higher. Otherread voltages BR and CR are set similarly to the read voltage AR. A readpass voltage Vread is set as a voltage higher than the maximum thresholdvoltage in the highest threshold distribution. The memory celltransistor MT with the read pass voltage Vread applied to the gatethereof is set to an on state regardless of the data stored therein.

The number of bits in the data stored in one memory cell transistor MTand the data assignment to the threshold distributions of the memorycell transistors MT are only illustrative and are not limited to thosedescribed above. For example, data of 1 bit or 3 or more bits may bestored in one memory cell transistor MT or various data assignments maybe applied to the threshold distributions.

[1-1-3] Configuration of the Row Decoder Module 12

FIG. 4 is a block diagram illustrating a configuration example of therow decoder module 12A and 12B included in the semiconductor memorydevice 10 according to the first embodiment. FIG. 4 illustrates arelationship between each block BLK included in the memory cell array 11and the row decoder modules 12A and 12B. As illustrated in FIG. 4 , therow decoder module 12A includes a plurality of row decoders RDA, and therow decoder module 12B includes a plurality of row decoders RDB.

The plurality of row decoders RDA is provided in association witheven-numbered blocks (for example, BLK0, BLK2, . . . ), and theplurality of row decoders RDB is provided in association withodd-numbered blocks (for example, BLK1, BLK3, . . . ). Specifically, forexample, the blocks BLK0 and BLK2 are associated with the different rowdecoders RDA, and the blocks BLK1 and BLK3 are associated with thedifferent row decoders RDB.

A voltage supplied by the voltage generator 19 via one of the rowdecoders RDA and RDB is applied to each block BLK. The row decoders RDAapply voltages to the word lines WL in the respective even-numberedblocks from a first side of the word lines WL in an extending directionthereof. The row decoders RDB apply voltages to the word lines WL in therespective odd-numbered blocks from a second side of the word lines WLin the extending direction. As illustrated in FIG. 4 , areas AR1 and AR2are defined for the above-described configuration.

The areas AR1 and AR2 are defined by dividing the memory cell array 11in the extending direction of the word lines WL (an extending directionof the blocks BLK). The area AR1 corresponds to an area on the firstside of the word lines WL in the extending direction thereof, and thearea AR2 corresponds to an area on the second side of the word lines WLin the extending direction thereof. An area near an area where the rowdecoder RDA or RDB corresponding to each block BLK is connected to theblock BLK is hereinafter referred to as “Near”. An area far from thearea where the row decoder RDA or RDB is connected to the block BLK ishereinafter referred to as “Far”. In other words, for example, in theblock BLK0, the area AR1 corresponds to the Near side, and the area AR2corresponds to the Far side. Likewise, in the block BLK1, the area AR2corresponds to the Near side, and the area AR1 corresponds to the Farside.

[1-1-4] Configuration of the Sense Amplifier Module 13 and the VoltageGeneration Circuit 19

FIG. 5 is a block diagram illustrating a detailed configuration exampleof the sense amplifier module 13 and voltage generator 19 included inthe semiconductor memory device 10 according to the first embodiment. Asillustrated in FIG. 5 , the sense amplifier module 13 includes aplurality of sense amplifier groups SAG, and the voltage generator 19includes BLC drivers DR1 and DR2.

The sense amplifier groups SAG include, for example, sense amplifierunits SAU0 to SAU7 arrayed along an extending direction of the bit linesBL. One bit line BL is connected to each of the sense amplifier unitsSAU. In other words, the number of the sense amplifier units SAUincluded in the sense amplifier module 13 corresponds, for example, tothe number of the bit lines BL. A set of the sense amplifier units SAUconnected to the bit lines BL corresponding to the NAND strings NSprovided in the area AR1 is hereinafter referred to as a sense amplifiersegment SEG1. A set of the sense amplifier units SAU connected to thebit lines BL corresponding to the NAND strings NS provided in the areaAR2 is referred to as a sense amplifier segment SEG2.

For example, if an even-numbered block is selected in the readoperation, the sense amplifier units SAU corresponding to the area AR1read data from memory cells provided on the Near side of the selectedblock, and the sense amplifier units SAU corresponding to the area AR2read data from memory cells provided on the Far side of the selectedblock. Likewise, if an odd-numbered block is selected in the readoperation, the sense amplifier units SAU corresponding to the area AR1read data from the memory cells provided on the Far side of the selectedblock, and the sense amplifier units SAU corresponding to the area AR2read data from memory cells provided on the Near side of the selectedblock.

The BLC drivers DR1 and DR2 generate control signals BLC1 and BLC2 basedon voltages generated by a charge pump not illustrated in the drawings.The BLC driver DR1 supplies the resultant control signal BLC1 to thesense amplifier units SAU included in the segment SEG1. The BLC driverDR2 supplies the resultant control signal BLC2 to the sense amplifierunits SAU included in the segment SEG2.

A detailed circuit configuration of each sense amplifier unit SAUdescribed above is, for example, as illustrated in FIG. 6 . FIG. 6illustrates an example of the detailed circuit configuration of one ofthe sense amplifier units SAU in the sense amplifier module 13. Asillustrated in FIG. 6 , the sense amplifier unit SAU includes senseamplifier portions SA connected to be able to transmit and receive datato and from one another and latch circuits SDL, LDL, UDL, and XDL.

Each of the sense amplifier portions SA senses data read out onto thecorresponding bit line BL to determine whether the read data is “0” or“1”. As illustrated in FIG. 6 , the sense amplifier portion SA includesa p-channel MOS transistor 20, n-channel MOS transistors 21 to 27, and acapacitor 28.

A first end of the transistor 20 is connected to a power supply line,and a gate of the transistor 20 is connected to a node INV. A first endof the transistor 21 is connected to a second end of the transistor 20,and a second end of the transistor 21 is connected to a node COM, and acontrol signal BLX is input to a gate of the transistor 21. A first endof the transistor 22 is connected to the node COM, a second end of thetransistor 22 is connected to the bit line BL, and a control signal BLCis input to a gate of the transistor 22. A first end of the transistor23 is connected to the node COM, a second end of the transistor 23 isconnected to a node SRC, and a gate of the transistor 23 is connected tothe node INV. A first end of the transistor 24 is connected to thesecond node of the transistor 20, a second end of the transistor 24 isconnected to a node SEN, and a control signal HLL is input to a gate ofthe transistor 24. A first end of the transistor 25 is connected to thenode SEN, a second end of the transistor 25 is connected to the nodeCOM, and a control signal XXL is input to a gate of the transistor 25. Afirst end of the transistor 26 is grounded, and a gate of the transistor26 is connected to the node SEN. A first end of the transistor 27 isconnected to a second end of the transistor 26, a second end of thetransistor 27 is connected to a bus LBUS, and a control signal STB isinput to a gate of the transistor 27. A first end of the capacitor 28 isconnected to the node SEN, and a clock CLK is input to a second end ofthe capacitor 28.

The latch circuits SDL, LDL, UDL, and XDL can temporarily hold the readdata, and the latch circuit XDL is connected to the input/output circuit14 and used to input and output data between the sense amplifier unitSAU and the input/output circuit 14. As illustrated in FIG. 6 , thelatch circuit SDL includes inverters 30 and 31 and n-channel MOStransistors 32 and 33.

The inverter 30 includes an input terminal connected to the node INV andan output terminal connected to a node LAT. The transistor 32 includes afirst end connected to the node INV, a second end connected to the busLBUS, and a gate to which a control signal STI is input. The transistor33 includes a first end connected to the node LAT, a second endconnected to the bus LBUS, and a gate to which a control signal STL isinput. A circuit configuration of each of the latch circuits LDL, UDL,and XDL is similar to, for example, the circuit configuration of thelatch circuit SDL, and will thus not be described below.

In the configuration of the sense amplifier unit SAU described above,for example, a voltage Vdd corresponding to a power supply voltage ofthe semiconductor memory device 10 is applied to the power supply lineconnected to the first end of the transistor 20. A voltage Vsscorresponding to a ground voltage of the semiconductor memory device 10is applied to the node SRC. The various control signals described aboveare generated by, for example, the sequencer 17.

The configuration of the sense amplifier module 13 according to thefirst embodiment is not limited to this. For example, the number of thelatch circuits provided in the sense amplifier unit SAU may be designedto have any value. In this case, the number of the latch circuits isdesigned based on the number of bits in the data held by one memory celltransistor MT. By way of example, the case where the sense amplifierunits SAU correspond to the bit lines BL on a one-to-one basis has beendescribed. However, the present invention is not limited to this. Forexample, a plurality of bit lines BL may be connected to one senseamplifier unit SAU via a selector.

[1-1-5] Structure of the Semiconductor Memory Device 10

The structures of the memory cell array 11, row decoder module 12, andsense amplifier module 13 included in the semiconductor memory device 10according to the first embodiment will be described.

FIG. 7 illustrates an example of a plane layout of the memory cell array11 according to the first embodiment. FIG. 7 illustrates an example of aplane layout of one string unit SU0 in the memory cell array 11. In thedrawings described below, an X axis corresponds to the extendingdirection of the word lines WL, a Y axis corresponds to the extendingdirection of the bit lines BL, and a Z axis corresponds to a verticaldirection with respect to a substrate surface.

As illustrated in FIG. 7 , the string unit SU0 is provided betweencontact plugs LI extending in the X direction and located adjacent toeach other in the Y direction. Each of the contact plugs LI is providedin a slit which insulates the adjacent string units SU from each other.In other words, in an area not illustrated in the drawings in the memorycell array 11, an array of a plurality of contact plugs LI is providedin the Y direction, and the string units SU are each provided betweenthe adjacent contact plugs LI.

In such a configuration of the string unit SU0, an area CR and an areaHR are defined in the X direction. The area CR is an area functioning asa substantial data holding area, and the area CR is provided with aplurality of semiconductor pillars MH. One semiconductor pillar MHcorresponds to, for example, one NAND string NS. The area HR is an areawhere various interconnects provided in the string unit SU0 areconnected to the row decoder module 12A. Specifically, the string unitSU0 is provided with, for example, a conductor 41 functioning as aselect gate line SGS, eight conductors 42 functioning as the word linesWL0 to WL7, and a conductor 43 functioning as a select gate line SGD insuch a manner that each of the conductors includes a portion whichoverlaps none of the upper-layer conductors. Ends of the conductors 41to 43 are connected, via respective conductive via contacts VC, to therow decoder module 12A provided below the string unit SU.

An example of a sectional structure of the memory cell array 11described above is illustrated in FIG. 8 and FIG. 9 . FIG. 8 and FIG. 9illustrate an example of a sectional structure of one string unit SU0 inthe memory cell array 11, and FIG. 8 illustrates a cross section takenalong line VIII-VIII in FIG. 7 . FIG. 9 illustrates a cross sectiontaken along the X direction in FIG. 7 and depicts a structure in thearea HR associated with the word line WL0 (the conductor 42), thestructure being extracted from FIG. 7 . Illustration of interlayerinsulating films is omitted in the drawings described below, and thestructure of the semiconductor pillars MH in the area CR is omitted fromFIG. 9 .

As illustrated in FIG. 8 , the memory cell array 11 includes a conductor40 provided above a P-type well area 50 formed on a semiconductorsubstrate and functioning as a source line SL. The conductor 40 isprovided with a plurality of the contact plugs LI thereon. Between theadjacent contact plugs LI and above the conductor 40, for example, aconductor 41, eight layers of conductors 42, and a conductor 43 areprovided in this order in the Z direction.

The conductors 40 to 43 are each shaped like a plate spreading in the Xdirection and the Y direction. The contact plugs LI are each shaped likea plate spreading in the X direction and the Z direction. A plurality ofsemiconductor pillars MH is provided to extend through the conductors 41to 43. Specifically, the semiconductor pillars MH are formed to extendfrom a top surface of the conductor 43 to a top surface of the conductor40.

Each of the semiconductor pillars MH includes, for example, a blockinsulating film 45, an insulating film (a charge storage layer) 46, atunnel oxide film 47, and a conductive semiconductor material 48.Specifically, the tunnel oxide film 47 is provided around thesemiconductor material 48, the insulating film 46 is provided around thetunnel oxide film 47, and the block insulating film 45 is providedaround the insulating film 46. The semiconductor material 48 may containa different material.

In such a structure, a portion of the conductor 41 which intersects thesemiconductor pillar MH functions as the select transistor ST2. Aportion of the conductor 42 which intersects the semiconductor pillar MHfunctions as the memory cell transistor MT. A portion of the conductor43 which intersects the semiconductor pillar MH functions as the selecttransistor ST1.

A conductive via contact BC is provided on the semiconductor material 48of the semiconductor pillar MH. A conductor 44 functioning as the bitline BL is provided on the via contact BC in such a manner as to extendin the Y direction. In each string unit SU, one semiconductor pillar MHis connected to one conductor 44. In other words, in each string unitSU, for example, different semiconductor pillars MH are connected to therespective conductors 44 arrayed in the X direction.

As illustrated in FIG. 9 , n⁺ impurity diffusion areas 51 and 52 areformed in a front surface of a P-type well area 50 in the area HR. Aconductor 53 is provided between the diffusion areas 51 and 52 and onthe P-type well area 50, via a gate insulating film not illustrated inthe drawings. The diffusion areas 51 and 52 and the conductor 53function as a source electrode, a drain electrode, and a gate electrodeof a transistor TR. The transistor TR is included in the row decodermodule 12A. A via contact VC is provided on the diffusion area 51. Thevia contact VC extends through the conductors 40 to 42 and is connectedto a conductor 54. The via contact VC is insulated from the conductors40 to 42 by an insulating film. The conductor 54 is provided, forexample, in an interconnect layer between an interconnect layer wherethe conductor 43 is provided and an interconnect layer where theconductor 44 is provided. The via contact VC is connected to theconductor 42 corresponding to the word line WL0 via the conductive viacontact HU. A spacing between the via contact HU and the semiconductorpillar MH varies according to an area where the semiconductor pillar MHis provided. The Near side and the Far side described using FIG. 4 aredefined based on the distance between the via contact HU and thesemiconductor pillar MH. Specifically, the spacing in the X directionbetween the via contact HU connected to any one of the conductors 42 andthe semiconductor pillar MH provided on the Near side is shorter thanthe spacing in the X direction between the via contact HU and thesemiconductor pillar MH provided on the Far side.

In such a configuration, the row decoder module 12A can supply a voltageto the conductor 42 corresponding to the word line WL0 via thetransistor TR. The semiconductor memory device 10 is provided with aplurality of the transistors TR and a plurality of the conductors 54none of which are illustrated in the drawings, in association with theconductors 41 to 43. The row decoder module 12A supplies a voltage tothe conductors corresponding to the various interconnects via thetransistors TR. An interconnect layer where the conductor 53corresponding to the gate electrode of the transistor TR is formed isreferred to as an interconnect layer GC. An interconnect layer where theconductor 44 corresponding to the bit line BL is formed is referred toas an interconnect layer M1.

A plane layout of the string unit SU corresponding to the odd-numberedblock BLK corresponds to, for example, reversal of the planar layout ofthe string unit SU illustrated in FIG. 7 , using the Y axis as an axisof symmetry. In other words, the cell area CR is provided between thehookup area HR corresponding to the even-numbered block and the hookuparea HR corresponding to the odd-numbered block. The remaining part ofthe structure of the string unit SU corresponding to the odd-numberedblock BLK is similar to the structure of the string unit SUcorresponding to the even-numbered block, and thus, description of theremaining part is omitted.

The structure of the memory cell array 11 according to the firstembodiment is not limited to the above-described structure. For example,in the above description, the select gate lines SGS and SGD include theone layer of the conductor 41 and the one layer of the conductor 43,respectively, the select gate lines SGS and SGD may each include aplurality of layers of the conductors. The number of conductors 42through which one semiconductor pillar MH extends is not limited tothis. For example, when one semiconductor pillar MH extends through nineor more conductors 42, nine or more memory cell transistors MT can beincluded in one NAND string NS.

Now, a sectional structure of the sense amplifier module 13 will bedescribed using FIG. 10 . FIG. 10 illustrates an example of a sectionalstructure of an area where the gate electrode of the transistor 22included in the sense amplifier module 13 is formed. As illustrated inFIG. 10 , conductors 55A and 55B functioning as the gate electrode ofthe transistor 22 are provided on the P-type well area 50 via a gateinsulating film not illustrated in the drawings.

The conductors 55A and 55B are provided in the interconnect layer GC,the conductor 55A extends over an area AR1 in the X direction, and theconductor 55B extends over an area AR2 in the X direction. The conductor55A and the conductor 55B are insulated from each other by a slit ST. Avia contact TRC is provided on an end portion of the conductor 55A, anda conductor 56A is provided on the via contact TRC. A via contact TRC isprovided on an end portion of the conductor 55B, and a conductor 56B isprovided on the via contact TRC. The conductors 56A and 56B are formed,for example, in an interconnect layer M2 above the interconnect layerM1.

The conductors 56A and 56B are connected to BLC drivers DR1 and DR2 inan area not illustrated in the drawings. In other words, the BLC driverDR1 applies a voltage corresponding to a control signal BLC1 via theconductor 56A and the via contact TRC, and the BLC driver DR2 applies avoltage corresponding to a control signal BLC2 via the conductor 56B andthe via contact TRC. By way of example, the case where the conductor 55and the conductor 56 are connected together via one via contact TRC hasbeen described. However, the present invention is not limited to this.For example, the conductor 55 and the conductor 56 may be connectedtogether via a plurality of via contacts TRC.

[1-2] Operations

The semiconductor memory device 10 according to the first embodimentperforms a kick operation in the read operation. The kick operation is avoltage application method of temporarily setting a driving voltage of adriver to a value higher than a target voltage value, and when a giventime has elapsed, reducing the driving voltage down to the targetvoltage value. The kick operation is performed, for example, on the wordline WL or the control signals BLX and BLC. For example, when the kickoperation is performed on the control signals BLX and BLC, the amount ofcurrent supplied to each bit line BL increases to charge the bit lineBL. A voltage which is higher than the target voltage and which isapplied before the target voltage is applied is hereinafter referred toas a kick voltage. A difference between the target voltage and the kickvoltage is hereinafter referred to as a kick amount.

According to the first embodiment, when the kick operation is performedon the control signal BLC, a control method for the control signals BLC1and BLC2 vary depending on whether an even-numbered block or anodd-numbered block is selected.

FIG. 11 illustrates an example of the control method for the controlsignals BLC1 and BLC2 during a period when the kick operation isperformed on the word line WL. As illustrated in FIG. 11 , when theselected block is an odd-numbered block, the sequencer 17 performs thekick operation on the control signal BLC1, while not performing the kickoperation on the control signal BLC2. On the other hand, when theselected block is an odd-numbered block, the sequencer 17 performs thekick operation on the control signal BLC2, while not performing the kickoperation on the control signal BLC1.

In other words, the sequencer 17 of the semiconductor memory device 10controls the BLC drivers DR1 and DR2 in such a manner that the kickoperation is performed on the control signal BLC supplied to the senseamplifier segment SEG corresponding to the Near side and not performedon the control signal BLC supplied to the sense amplifier segment SEGcorresponding to the Far side.

FIG. 12 illustrates examples of waveforms in the read operation of thesemiconductor memory device 10 according to the first embodiment. FIG.12 illustrates examples of the waveforms for the selected word line WL,the waveforms for the bit lines BL corresponding to the Near side andthe Far side, and the waveforms of various control signals, thewaveforms all corresponding to the block BLK of interest. For thewaveforms for the word line WL illustrated in FIG. 12 , the solid linecorresponds to a waveform associated with the Near side, and the dashedline corresponds to a waveform associated with the Far side. For thewaveforms of the control signal BLC, the solid line corresponds to awaveform of the control signal BLC1, and the dashed line corresponds toa waveform of the control signal BLC2. In the description below, whenthe control signal BLC1 and BLC2 need not be distinguished from eachother, operations of the control signals BLC1 and BLC2 are collectivelydescribed as the operation of the control signal BLC.

In the description below, an N-channel MOS transistor to which variouscontrol signals are input is assumed to be set to the on state when an“H” level voltage is applied to a gate of the transistor and to an offstate when an “L” level voltage is applied to the gate of thetransistor. The memory cell transistor MT corresponding to the selectedword line WL is referred to as a selected memory cell.

As illustrated in FIG. 12 , in an initial state preceding a time t0, forexample, the voltages of the word lines WL and the control signals BLXand BLC1 are set to the voltage Vss, the voltages of the control signalsHLL, XXL, and STB are set to the “L” level, and the voltage of each bitline BL is set to the voltage Vss.

At the time t0, when the read operation is started, the row decodermodule 12 applies, For example, the read pass voltage Vread to theselected word line WL. Variation in the voltage of the word line WL isfaster on the Near side than on the Far side.

The sequencer 17 sets the voltage of the control signal BLC to a voltageVb1 xL and sets the voltage of the control signal BLC to a voltage Vb1cL. Then, the memory cell transistor MT with the voltage Vread appliedthereto, the transistor 21 with the voltage Vb1 xL applied thereto, andthe transistor 22 with the voltage Vb1 cL applied thereto are set to theon state. Consequently, the sense amplifier module 13 supplies a currentto the bit line BL, and the voltage of the bit line BL increases to avoltage VBLL.

At a time t1, the sequencer 17 sets the voltage of the control signalBLX to a voltage Vb1 x, sets the voltage of the control signal BLC to avoltage Vb1 c, and sets the control signal HLL to the “H” level. Thevoltage Vb1 x is higher than the voltage Vb1 xL, and the voltage Vb1 cis higher than the voltage Vb1 cL. At this time, the sequencer 17 mayperform the kick operation, for example, on the control signals BLX andBLC. In this case, for example, a voltage higher than the desiredvoltage by an amount equal to a voltage BLkick is temporarily applied tothe control signals BLX and BLC. The transistors 21 and 22 with thevoltage of the gate increased allow more current to pass through,increasing the voltage of the bit line BL. If the selected memory cellis in the on state, the voltage of the bit line BL changes to a voltageVBLon. If the selected memory cell is in the off state, the voltage ofthe bit line BL changes to a voltage VBLoff higher than the voltageVBLon. When the control signal HLL is set to the “H” level, thetransistor 24 is set to the on state to charge the node SEN. Whencharging of the node SEN is completed, the sequencer 17 sets the controlsignal HLL to the “L” level.

At a time t2, the sequencer 17 sets the control signal XXL to the “H”level. When the control signal XXL is set to the “H” level, thepotential of the node SEN changes based on the state of the selectedmemory cell. The sequencer 17 then sets the control signal STB to the“H” level and determines whether or not the threshold voltage of theselected memory cell is equal to or higher than the voltage AR based onthe state of the node SEN. The sequencer 17 holds the result of thedetermination in the latch circuit in the sense amplifier unit SAU.Subsequently, the sequencer 17 sets the control signal XXL to the “L”level.

At a time t3, the row decoder module 12A applies, for example, the readvoltage CR to the word line WL. At this time, the kick operation isapplied to the word line WL and to the control signals BLX and BLC1.Specifically, the row decoder module 12A temporarily applies a kickvoltage CR+CGkick to the selected word line WL. The kick voltageCR+CGkick appears, for example, as the Near-side voltage of the wordline WL. On the other hand, the Far-side voltage of the word line WL,for example, increases up to the voltage CR without exceeding thevoltage CR due to a RC delay in the interconnects. The magnitude of thekick amount CGkick can be set to any numerical value.

During a period when the kick voltage is applied to the selected wordline WL, the sequencer 17, for example, temporarily increases thevoltage of the control signal BLX by an amount equal to a voltageBLkick, temporarily increases the voltage of the control signal BLC1 byan amount equal to a voltage BLkickh higher than the voltage BLkick, andmaintains the voltage of the control signal BLC2 at the voltage Vb1 c.

If the threshold voltage of the selected memory cell corresponding tothe Near side is lower than the voltage CR, the selected memory cellwith the kick voltage applied thereto maintains the on state or changesfrom the off state to the on state, thus changing the voltage of eachbit line BL to the voltage VBLon. On the other hand, if the thresholdvoltage of the selected memory cell corresponding to the Near side isequal to or higher than the voltage CR, the Near side voltage of theword line WL is higher than the voltage CR, and thus, the correspondingmemory cell may be subjected to false turn-on. The false turn-on refersto a phenomenon in which the memory cell transistor MT having athreshold voltage lower than a predetermined read voltage isunintentionally set to the on state by the kick voltage. At this time,the voltage of the bit line BL may decrease, but returns to the voltageVBLoff in a short time because the kick operation on the control signalsBLX and BLC1 has increased the amount of current supplied to the bitline BL.

If the threshold voltage of the selected memory cell corresponding tothe Far side is lower than the voltage CR, the selected memory cell withthe voltage CR applied thereto maintains the on state or changes fromthe off state to the on state, thus changing the voltage of the bit lineBL to the voltage VBLon. On the other hand, if the threshold voltage ofthe selected memory cell corresponding to the Far side is equal to orhigher than the voltage CR, the Far side voltage of the word line WL is,for example, inhibited from exceeding the voltage CR, thus suppressingpossible false turn-on in the corresponding to selected memory cell. Inother words, if the threshold voltage of the selected memory cellcorresponding to the Far side is equal to or higher than the voltage CR,the voltage of each bit line BL is maintained at the voltage VBLoff. Theoperation of the control signal HLL at the time t3 is similar to theoperation of the control signal HLL at the time t1.

At a time t4, the sequencer 17 sets the control signal XXL to the “H”level. When the control signal XXL is set to the “H” level, thepotential of the node SEN changes based on the state of the selectedmemory cell. The sequencer 17 then sets the control signal STB to the“H” level and determines whether or not the threshold voltage of theselected memory cell is equal to or higher than the voltage CR based onthe state of the node SEN. The sequencer 17 holds the result of thedetermination in the latch circuit in the sense amplifier unit SAU.Subsequently, the sequencer 17 sets the control signal XXL to the “L”level.

At a time t5, the row decoder module 12A and the sequencer 17 restoresthe word line WL and the control signals BLX and BLC to the initialstate to end the read operation on the page.

In the read operation described above, the operations performed if anodd-numbered block is selected are similar to the operations performedif an even-numbered block is selected except that the operation of therow decoder module 12A is performed by the row decoder module 12Binstead and that the operation of the control signal BLC1 is replacedwith the operation of the control signal BLC2.

[1-3] Effects of the First Embodiment

The semiconductor memory device 10 according to the above-describedfirst embodiment enables the read operation to be performed faster.Effects of the semiconductor memory device 10 according to the firstembodiment will be described in detail.

In a semiconductor memory device with memory cells three-dimensionallystacked therein, the conductors 42 formed like plates are used as theword lines WL, for example, as illustrated in FIG. 7 and FIG. 8 . Theword lines WL with such a structure tend to suffer a long RC delay. Whena voltage is applied to one end of the word line WL, a voltage increasespeed may vary between an area near the driver (Near side) and an areafar from the driver (Far side). Thus, the semiconductor memory devicemay perform, for example, the kick operation in order to assist inincreasing the voltage on the Far side of the word line WL, which has arelatively low voltage increase speed.

Now, an example of the read operation of the semiconductor memory deviceaccording to a comparative example of the first embodiment will bedescribed using FIG. 13 . FIG. 13 illustrates examples of the waveformsfor the Near side and Far side of the word line WL, the waveforms ofvarious control signals, and the waveform for the bit line BL. Thewaveforms in FIG. 13 are different from the waveforms in the readoperation described using FIG. 12 in that the common control signal BLCis used both on the Near side and on the Far side.

As illustrated in FIG. 13 , when the kick operation is performed on theword line WL at the time t3, the voltage on the Near side of the wordline WL increases above the voltage CR. Then, if the selected memorycell corresponding to the Near side has a threshold voltage equal to orhigher than the voltage CR, the corresponding memory cell may be falselyturned on. The voltage of the bit line BL corresponding to the falselyturned-on memory cell decreases (over discharge) and returns to thevoltage VBLoff utilizing charging of the bit line BL resulting from thekick operation on the control signal BLC. A stabilization time providedfor the bit line BL taking the effect of the over discharge into accountcan be reduced with increasing the amount of kick in the control signalBLC.

On the other hand, at the time t3, the voltage on the Far side of theword line WL reaches the voltage CR without exceeding the voltage CR. Ifthe selected memory cell corresponding to the Far side has a thresholdvoltage lower than the voltage CR, the voltage of the bit line BLcorresponding to the memory cell having changed from the off state tothe on state decreases from the voltage VBLoff to the voltage VBLon. Atthis time, each bit line BL is charged under the effect of the kickoperation on the control signal BLC (overcharge), and thus, the voltageof the bit line BL decreases to the voltage VBLon, for example, afterthe kick operation on the control signal BLC ends. The stabilizationtime provided for the bit line BL taking the effect of the overchargeinto account can be reduced consistently with the amount of kick in thecontrol signal BLC.

In this manner, when the kick operation is performed on the word lineWL, the optimal amount of kick in the control signal BLC varies betweenthe Near side and the Far side. However, in the comparative example,since the common control signal BLC is used both on the Near side andthe Far side, the effect of the over discharge on the Near side istraded off for the effect of the overcharge on the Far side. Thus, inthe kick operation on the control signal BLC in the comparative example,an amount of kick BLkick smaller than an optimal amount of kick BLkickhin the control signal BLC is applied to the Near side, for example, inorder to provide a nearly equal stabilization time for the bit lines BLcorresponding to the Near side and for the bit lines BL corresponding tothe Far side.

In contrast, in the semiconductor memory device 10 according to thefirst embodiment, different control signals BLC are used for the senseamplifier unit SAU corresponding to the Near side of the word line WLand for the sense amplifier unit SAU corresponding to the Far side ofthe word line WL. The semiconductor memory device 10 according to thefirst embodiment for example executes control in such a manner as toperform the kick operation on the control signal BLC to be supplied tothe sense amplifier unit SAU corresponding to the Near side of the wordline WL, while not performing the kick operation on the control signalBLC to be supplied to the sense amplifier unit SAU corresponding to theFar side of the word line WL, when the kick operation is performed onthe word line WL in the read operation.

Consequently, the semiconductor memory device 10 according to the firstembodiment can, for example, apply a kick voltage higher than a normalkick voltage to the control signal BLC corresponding to the Near side,the bit lines BL corresponding to the Near side can be restrained frombeing over discharged. The semiconductor memory device 10 according tothe first embodiment, for example, does not perform the kick operationon the control signal BLC corresponding to the Far side and can thussuppress overcharging of the bit lines BL corresponding to the Far side.Therefore, the semiconductor memory device 10 according to the firstembodiment can reduce the stabilization time for the voltage of each bitline BL when the kick operation is performed on the word line WL,enabling an increase in the speed of the read operation.

By way of example, the case has been described where, when the kickoperation is performed on the word line WL, the BLC driver DR1corresponding to the Near side performs the kick operation, whereas theBLC driver DR2 corresponding to the Far side does not perform the kickoperation. However, the present invention is not limited to this. Forexample, both the BLC driver DR1 corresponding to the Near side and theBLC driver DR2 corresponding to the Far side may perform the kickoperation, with a difference in the amount of kick between the BLCdrivers DR1 and DR2. In this case, For example, the kick voltage in theBLC driver DR1 corresponding to the Near side is set higher than thekick voltage in the BLC driver DR2 corresponding to the Far side. Evenin such a case, the semiconductor memory device 10 can produce effectssimilar to the above-described effects.

[2] Second Embodiment

In the semiconductor memory device 10 according to the secondembodiment, the sense amplifier module 13 is divided into three areas ineach of which the control signal BLC is controlled. The semiconductormemory device 10 according to the second embodiment will be described inconjunction with differences from the first embodiment.

[2-1] Configuration

FIG. 14 is a block diagram illustrating a configuration example of thememory cell array 11 and the row decoder module 12 included in thesemiconductor memory device 10 according to the second embodiment. Theconfiguration in FIG. 14 is different from the configuration describedin the first embodiment using FIG. 4 in the extents of the definedareas.

Specifically, as illustrated in FIG. 14 , the memory cell array 11according to the second embodiment includes an area AR3 defined betweenthe area AR1 and the area AR2. The area AR3 is provided, for example, insuch a manner that a distance from the row decoder RDA to the area AR3in the even-numbered block BLK is similar to a distance from the rowdecoder RDB to the area AR3 in the odd-numbered block BLK. In otherwords, the position of the area AR3 in each block is defined, forexample, in such a manner that the distance from the corresponding rowdecoder includes an intermediate position between “Near” and “Far”.

In other words, a spacing between the via contact HU connected to anyone of the conductors 42 and the semiconductor pillar MH provided in thearea AR3 in the extending direction of the word line WL is longer than aspacing between the via contact HU and the semiconductor pillar MHprovided on the Near side in the extending direction of the word line WLand shorter than a spacing between the via contact HU and thesemiconductor pillar MH provided on the Far side in the extendingdirection of the word line WL.

FIG. 15 is a block diagram illustrating a detailed configuration exampleof the sense amplifier module 13 and the voltage generator 19 includedin the semiconductor memory device 10 according to the secondembodiment. The configuration in FIG. 15 is different from theconfiguration described in the first embodiment using FIG. 5 in that thesense amplifier module 13 further includes a sense amplifier segmentSEG3 and that the voltage generator 19 further includes a BLC driverDR3.

As illustrated in FIG. 15 , the segment SEG3 is provided between thesegment SEG1 and the segment SEG3. The sense amplifier units SAUincluded in the segment SEG3 is connected to the bit lines BLcorresponding to the NAND strings NS provided in the area AR3. The BLCdriver DR3 generates a control signal BLC3 based on a voltage generatedby a charge pump not illustrated in the drawings. The BLC driver DR3supplies the resultant control signal BLC3 to the sense amplifier unitsSAU included in the segment SEG3.

FIG. 16 is a diagram illustrating an example of a sectional structure ofthe sense amplifier module 13 included in the semiconductor memorydevice 10 according to the second embodiment. In this structure, theconfiguration corresponding to the area AR3 is added to theconfiguration described in the first embodiment using FIG. 10 .

Specifically, in the second embodiment as illustrated in FIG. 16 , aconductor 55C is provided on the P-type well area 50 via a gateinsulating film not illustrated in the drawings. The conductor 55Cextends over the area AR3 in the X direction, and is arranged betweenthe conductor 55A and the conductor 55B. The conductor 55C and each ofthe conductors 55A and 55B are insulated from each other by the slit ST.The via contact TRC is provided on the conductor 55C, and a conductor56C is provided on the via contact TRC. The conductor 56C is formed, forexample, in the interconnect layer M2 and connected to the BLC driverDR3 in an area not illustrated in the drawings. In other words, the BLCdriver DR3 applies a voltage corresponding to the control signal BLC3via the conductor 56C and the via contact TRC. The remaining part of theconfiguration of the semiconductor memory device 10 according to thesecond embodiment is similar to the corresponding part of theconfiguration of the semiconductor memory device 10 according to thefirst embodiment, and will thus not be described below.

[2-2] Operations

A read operation of the semiconductor memory device 10 according to thesecond embodiment is similar to the read operation of the semiconductormemory device 10 according to the first embodiment to which operationscorresponding to the sense amplifier segment SEG3 are added.Specifically, like the semiconductor memory device 10 according to thefirst embodiment, the semiconductor memory device 10 according to thesecond embodiment controllably determines whether or not to perform thekick operation on the control signal BLC for each sense amplifiersegment SEG during the period when the kick operation is performed onthe word line WL. FIG. 17 illustrates an example of a control method forthe kick operation for each segment SEG according to the secondembodiment.

As illustrated in FIG. 17 , if the selected block is the even-numberedblock BLK, the kick operation is performed on the control signal BLC1and not performed on the control signal BLC2 or BLC3. On the other hand,if the selected block is an odd-numbered block, the kick operation isperformed on the control signal BLC2 and not performed on the controlsignal BLC1 or BLC3. In other words, the sequencer 17 of thesemiconductor memory device 10 controls the BLC drivers DR1 to DR3 insuch a manner as to perform the kick operation on the segment SEGcorresponding to the Near side of each word line WL in the selectedblock, while not performing the kick operation on the segment SEGcorresponding to the Far side of each word line WL in the selected blockand on the segment SEG3 corresponding to a portion of each word line WLin the center of the block BLK. The other operations of thesemiconductor memory device 10 according to the second embodiment aresimilar to the corresponding operations of the semiconductor memorydevice 10 according to the first embodiment, and will thus not bedescribed below.

[2-3] Effects of the Second Embodiment

As described above, like the semiconductor memory device 10 according tothe first embodiment, the semiconductor memory device 10 according tothe second embodiment controls the control signals BLC corresponding tothe segments SEG1 and SEG2 corresponding to the Near side or the Farside and further controls the control signal BLC3 for the segment SEG3between the segment SEG1 and the segment SEG2. Specifically, thesemiconductor memory device 10 according to the second embodiment cancontrol the BLC driver DR3 to allow, for example, the control signalBLC3 corresponding to the segment SEG3 to perform the same operation asthat executed on one of the Near and Far sides.

In this manner, the semiconductor memory device 10 according to thesecond embodiment can controllably determine whether or not to performthe kick operation in a more detailed manner than the semiconductormemory device 10 according to the first embodiment, based on thedistance from the row decoder module 12. Therefore, as is the case withthe first embodiment, the semiconductor memory device 10 according tothe second embodiment can reduce the stabilization time for the voltageof each bit line BL upon performing the kick operation on the word lineWL, enabling an increase in the speed of the read operation.

By way of example, the case has been described where the control signalBLC3 corresponding to the segment SEG3 performs the same operation asthat executed on one of the Near and Far sides. However, the presentinvention is not limited to this. For example, the sequencer 17 mayperform the kick operation on the control signal BLC3 regardless of theselected block and set the amount of kick in the control signal BLC3during the kick operation smaller than the amount of kick in the controlsignal BLC corresponding to the Near-side segment SEG. Even in such acase, the semiconductor memory device 10 according to the secondembodiment can produce the effects described above.

[3] Third Embodiment

The semiconductor memory device 10 according to a third embodimentincludes a variable resistor provided for an interconnect through whichthe control signal BLC is supplied, to adjust the amount of kick in thecontrol signal BLC for each sense amplifier segment SEG. Thesemiconductor memory device 10 according to the third embodiment will bedescribed below in conjunction with differences from the first andsecond embodiments.

[3-1] Configuration

FIG. 18 is a block diagram illustrating a configuration example of thememory cell array 11 and the row decoder module 12 included in thesemiconductor memory device 10 according to a third embodiment. Theconfiguration in FIG. 18 is different from the configuration describedin the first embodiment using FIG. 4 in the extents of the definedareas.

Specifically, as illustrated in FIG. 18 , areas AR1 to AR5 are definedin the memory cell array 11 according to the second embodiment.Specifically, the areas AR1 to AR5 are areas defined along the extendingdirection of the block BLK. The area AR1 corresponds to a row decodermodule 12A-side area, and the area AR5 corresponds to a row decodermodule 12B-side area. In other words, for example, in the block BLK0,the area AR1 corresponds to the Near side, and the area AR5 correspondsto the Far side. Similarly, in the block BLK1, the area AR5 correspondsto the Near side, and the area AR1 corresponds to the Far side.

FIG. 19 is a block diagram illustrating a detailed configuration exampleof the sense amplifier module 13 and the voltage generator 19 includedin the semiconductor memory device 10 according to the third embodiment.As illustrated in FIG. 19 , in the third embodiment, the sense amplifiermodule 13 includes, for example, sense amplifier segments SEG1 to SEG5,select transistors 60 and 61, and variable resistors 62A to 62D.

Sense amplifier groups SAG1 to SAG5 each include the sense amplifierunits SAU connected to the bit lines BL corresponding to the NANDstrings NS provided in the corresponding one of the areas AR1 to AR5. Afirst end of the select transistor 60 is provided with the controlsignal BLC1 by the BLC driver DR1. A first end of the select transistor61 is provided with the control signal BLC2 by the BLC driver DR2.Control signals SELL and SELR are input to gates of the selecttransistors 60 and 61, respectively. The variable resistors 62A to 62Dare connected in series between a second end of the select transistor 60and a second end of the select transistor 61. The variable resistor 62Aincludes a transistor 63A and a resistance element 64A connected inparallel between a node ND1 and a node ND2. The variable resistor 62Bincludes a transistor 63B and a resistance element 64B connected inparallel between the node ND2 and a node ND3. The variable resistor 62Cincludes a transistor 63C and a resistance element 64C connected inparallel between the node ND3 and a node ND4. The variable resistor 62Dincludes a transistor 63D and a resistance element 64D connected inparallel between the node ND4 and a node ND5. Control signals S1 to S4are input to gates of the transistors 63A to 63D.

In the sense amplifier module 13 according to the third embodiment inthe configuration described above, the voltages of the nodes ND1 to ND5are supplied to the sense amplifier units SAU in the segments SEG1 toSEG5, respectively, as the control signals BLC for the segments SEG1 toSEG5. The various control signals described above are generated, forexample, by the sequencer 17.

[3-2] Operations

The waveforms of the various control signals for the read operation ofthe semiconductor memory device 10 according to the third embodiment aresimilar to the waveforms of the various control signals described in thefirst embodiment using FIG. 12 . In other words, in the thirdembodiment, the sequencer 17 controls the control signal BLC as is thecase with the segment SEG corresponding to the Near side of the wordline WL according to the first embodiment.

In the read operation according to the third embodiment, the sequencer17 changes the direction in which the control signal BLC is applied, andadjusts the amount of kick for each segment SEG based on the address ofthe selected word line WL. The plurality of word lines WL is hereinafterassumed to be classified into two groups. For example, the word lines WLare classified into a first group with a relatively large RC timeconstant and a second group with a relatively small RC time constant.

FIG. 20 illustrates an example of the control method for the kickoperation according to the third embodiment. The sequencer 17 ishereinafter assumed to maintain the control signals S1 to S4 at the “H”level during the read operation and to control the control signals S1 toS4 as described below during the kick operation.

As illustrated in FIG. 20 , if the selected block is an even-numberedblock, the sequencer 17 brings the control signals SELL and SELR to the“H” level and the “L” level, respectively, to set the transistors 60 and61 to the on state and the off state, respectively. Then, the controlsignal BLC1 is supplied to the modules in the sense amplifier module 13via the transistor 60. If any of the word lines WL in the first group isselected, the sequencer 17, for example, brings the control signals S1,S2, S3, and S4 to the “H” level, the “H” level, the “L” level, and the“L” level, respectively, to set the transistors 63A and 63B to the onstate, while setting the transistors 63C and 63D to the off state. Then,the control signal BLC1 supplied via the transistor 60 passes throughthe transistors 63A and 63B in the variable resistors 62A and 62B,respectively, and through the resistance elements 64C and 64D in thevariable resistors 62C and 62D, respectively. On the other hand, if anyof the word lines WL in the second group is selected, the sequencer 17,for example, brings the control signals S1, S2, S3, and S4 to the “H”level, the “L” level, the “L” level, and the “L” level, respectively, toset the transistor 63A to the on state, while setting the transistors63B, 63C, and 63D to the off state. Then, the control signal BLCsupplied via the transistor 60 passes through the transistor 63A in thevariable resistor 62A and through the resistance elements 64B, 64C, and64D in the variable resistors 62B, 62C, and 62D, respectively.

If the selected block is an odd-numbered block, the sequencer 17 bringsthe control signals SELL and SELR to the “L” level and the “H” level,respectively, to set the transistors 60 and 61 to the off state and theon state, respectively. Then, the control signal BLC2 is supplied to themodules in the sense amplifier module 13 via the transistor 61. If anyof the word lines WL in the first group is selected, the sequencer 17,for example, brings the control signals S1, S2, S3, and S4 to the “L”level, the “L” level, the “H” level, and the “H” level, respectively, toset the transistors 63C and 63D to the on state, while setting thetransistors 63A and 63B to the off state. Then, the control signal BLC2supplied via the transistor 61 passes through the transistors 63D and63C in the variable resistors 62D and 62C, respectively, and through theresistance elements 64B and 64A in the variable resistors 62B and 62A,respectively. On the other hand, if any of the word lines WL in thesecond group is selected, the sequencer 17, for example, brings thecontrol signals S1, S2, S3, and S4 to the “L” level, the “L” level, the“L” level, and the “H” level, respectively, to set the transistor 63D tothe on state, while setting the transistors 63A, 63B, and 63C to the offstate. Then, the control signal BLC2 supplied via the transistor 61passes through the transistor 63D in the variable resistor 62D andthrough the resistance elements 64C, 64B, and 64A in the variableresistors 62C, 62B, and 62A, respectively.

As described above, if the selected block is an even-numbered block, thecontrol signal BLC1 is provided via the transistor 60 in a directionfrom the node ND1 toward the node ND5. If the selected block is anodd-numbered block, the control signal BLC2 is provided via thetransistor 61 in a direction from the node ND5 toward the node ND1.Then, based on the address of the selected word line WL, the paths ofthe control signals BLC among the nodes ND1 to ND5 are changed.

FIG. 21 illustrates examples of waveforms obtained when an even-numberedblock and one of the word lines WL in the first group are selected inthe read operation of the semiconductor memory device 10 according tothe third embodiment. FIG. 21 illustrates the waveforms for the Nearside and Far side of the word line WL, the waveforms of the controlsignal BLC1 at the nodes ND1 to ND5, and the waveform of the controlsignal STB.

As illustrated in FIG. 21 , the waveforms for the Near side and Far sideof the word line WL and the waveform of the control signal STB aresimilar to the corresponding waveforms described in the first embodimentusing FIG. 12 . The waveform of the control signal BLC1 at the node ND1is similar to the waveform of the control signal BLC1 described in thefirst embodiment using FIG. 12 . The waveform of the control signal BLC1at the node ND2 attenuates because the signal is provided from the nodeND1 via the transistor 63A, with the amount of kick decreasing at thetime t3. The waveform of the control signal BLC1 at the node ND3attenuates because the signal is provided from the node ND2 via thetransistor 63B, with the amount of kick further decreasing at the timet3. For example, the effect of the kick operation becomes invisible. Thewaveforms of the control signal BLC1 at the nodes ND4 and ND5 are, forexample, similar to the waveform of the control signal BLC1 at the nodeND3 because the signal is provided via the transistors 63C and 63D,respectively. In this manner, the control signal BLC is supplied to thesense amplifier unit SAU in the corresponding segment SEG, with theamount of kick varied at the nodes ND. The other operations of thesemiconductor memory device 10 according to the third embodiment aresimilar to the corresponding operations of the semiconductor memorydevice 10 according to the first embodiment, and will thus not bedescribed below.

By way of example, the case has been described where the sequencer 17maintains the control signals S1 to S4 at the “H” level during the readoperation and controls the control signals S1 to S4 during the kickoperation. However, the present invention is not limited to this. Forexample, the sequencer 17 may control the control signals S1 to S4 asillustrated in FIG. 20 , in the read operations in general.

[3-3] Effects of the Third Embodiment

As described above, the semiconductor memory device 10 according to thethird embodiment is divided into smaller sense amplifier segments SEGthan the semiconductor memory device 10 according to the firstembodiment, and varies the direction in which the control signal BLC isapplied based on the address of the selected block BLK. Specifically,for example, the sequencer 17 sets the transistors 60 and 61 to the onstate and the off state, respectively, to allow the control signals BLCto be provided in a direction similar to the direction of the word lineWL if an even-numbered block is selected.

The sense amplifier module 13 according to the third embodiment includesthe variable resistors 62A to 62D to adjust the amount of kick in thecontrol signal BLC for each segment SEG based on characteristics of theselected word line WL. Specifically, the sequencer 17 sets thetransistor 63 in the variable resistor 62 to the off state in theNear-side area, and sets the transistor 63 in the variable resistor 62to the on state in the Far-side area. If the transistor 63 is in the offstate, the control signal BLC passes through the resistance element 64to attenuate and thus has a reduced amount of kick. If the transistor 63is in the on state, the control signal BLC passes through the transistor63 to have a variation in the voltage thereof suppressed.

Consequently, the semiconductor memory device 10 according to the thirdembodiment can adjust the amount of kick in the control signal BLCsupplied to each segment SEG. Therefore, as is the case with the firstand second embodiments, the semiconductor memory device 10 according tothe third embodiment can reduce the stabilization time for the voltageof each bit line BL when the kick operation is performed on the wordline WL, enabling an increase in the speed of the read operation.

By way of example, the case has been described where the memory cellarray 11 is divided into the areas AR1 to AR5 and where the senseamplifier module 13 includes the four variable resistors 62. However,the present invention is not limited to this. For example, the number ofthe variable resistors 62 included in the sense amplifier module 13 isdesigned based on the number of the areas AR into which the memory cellarray 11 is divided for control.

Furthermore, by way of example, the case where the BLC drivers DR1 andDR2 are used has been described. However, the present invention is notlimited to this. For example, the semiconductor memory device 10 mayvary the direction in which the control signal BLC is supplied to thesense amplifier module 13 by controlling the transistors 60 and 61connected to the common BLC driver DR.

[4] Fourth Embodiment

In the semiconductor memory device 10 according to a fourth embodiment,a common interconnect in the sense amplifier module 13 is used to applythe control signal BLC, and the different control signals BLC areapplied to an array of the sense amplifier groups SAG from therespective opposite ends thereof. The semiconductor memory device 10according to the fourth embodiment will be described in conjunction withdifferences from the first to third embodiments.

[4-1] Configuration

FIG. 22 is a block diagram illustrating a detailed configuration exampleof the sense amplifier module 13 and the voltage generator 19 includedin the semiconductor memory device 10 according to the fourthembodiment. The configuration in FIG. 22 corresponds to theconfiguration described in the first embodiment using FIG. 5 and towhich the BLC drivers DR1 and DR2 are connected commonly to the senseamplifier units SAU in the sense amplifier module 13.

Specifically, for example, for each of the sense amplifier units SAU0 toSAU7 of each sense amplifier group SAG, the sense amplifier units SAU inthe sense amplifier groups SAG are commonly connected together, forexample, by an interconnect extending in a direction intersecting thebit lines BL as illustrated in FIG. 22 . Then, first ends of theinterconnects connecting the sense amplifier units SAU together areconnected commonly to the BLC driver DR1, and second ends of theinterconnects are connected commonly to the BLC driver DR2. In otherwords, for the interconnects through which the control signal BLC issupplied to the sense amplifier units SAU in the sense amplifier module13, the first end is connected to the BLC driver DR1, and the second endis connected to the BLC driver DR2. The BLC driver DR1 applies a voltagecorresponding to the control signal BLC1 through a first end of thesense amplifier module 13. The BLC driver DR2 applies a voltagecorresponding to the control signal BLC2 through a second end of thesense amplifier module 13.

FIG. 23 is a diagram illustrating an example of a sectional structure ofthe sense amplifier module 13 included in the semiconductor memorydevice 10 according to the fourth embodiment. The configuration in FIG.23 corresponds to the configuration described in the first embodimentusing FIG. 10 and in which the conductors 55 and 56 are integratedtogether.

Specifically, as illustrated in FIG. 23 , the integral conductor 55 isformed in an interconnect layer GC, the integral conductor 56 is formedin an interconnect layer M2, and a plurality of via contacts TRC isprovided between the conductors 55 and 56. In an area not illustrated inthe drawings, a first end of the conductor 56 is connected to the BLCdriver DR1, and a second end of the conductor 56 is connected to the BLCdriver DR2. Voltages corresponding to the control signals BLC1 and BLC2are applied to the conductor 56 through the first and second endsthereof, respectively, and applied to the conductor 55 via the viacontacts TRC. The remaining part of the configuration of thesemiconductor memory device 10 according to the fourth embodiment issimilar to the corresponding part of the configuration of thesemiconductor memory device 10 according to the first embodiment, andwill thus not be described below.

[4-2] Operations

As is the case with the operations of the semiconductor memory device 10described in the first embodiment using FIG. 11 , the semiconductormemory device 10 according to the fourth embodiment controllablydetermine whether or not to perform the kick operation on the controlsignal BLC1 and the control signal BLC2 based on the selected block BLK.Specifically, for example, if the selected block is an even-numberedblock, the kick operation is performed on the control signal BLC1 andnot performed on the control signal BLC2. On the other hand, if theselected block is an odd-numbered block, the kick operation is performedon the control signal BLC2 and not performed on the control signal BLC1.

FIG. 24 illustrates examples of waveforms obtained when an even-numberedblock and one of the word lines WL in the first group are selected inthe read operation of the semiconductor memory device 10 according tothe fourth embodiment. FIG. 24 illustrates the waveforms for the Nearside and Far side of the word line WL, the waveforms of the controlsignals BLC1 and BLC2, and the waveform of the control signal STB.

As illustrated in FIG. 24 , the waveforms for the Near side and Far sideof the word line WL and the waveform of the control signal STB aresimilar to the corresponding waveforms described in the first embodimentusing FIG. 12 . The waveform of the control signal BLC1 is similar tothe waveform of the control signal BLC1 described in the firstembodiment using FIG. 12 . The waveform of the control signal BLC2 issimilar to the waveform of the control signal BLC2 described in thefirst embodiment using FIG. 12 . In the semiconductor memory device 10according to the fourth embodiment, when the kick operation is performedon the word line WL at the time t3, the BLC driver DR1 temporarilyapplies a voltage higher than the voltage Vb1 c by an amount equal tothe voltage BLkickh, and the BLC driver DR2 maintains the voltage Vb1 c.The other operations of the semiconductor memory device 10 according tothe third embodiment are similar to the corresponding operations of thesemiconductor memory device 10 according to the first embodiment, andwill thus not be described below.

[4-3] Effects of the Forth Embodiment

As described above, the semiconductor memory device 10 according to thefourth embodiment includes the BLC driver DR1 and DR2 which can applyvoltages to the sense amplifier module 13 through the first and secondends, respectively, of the interconnects through which the controlsignal BLC is supplied. The BLC drivers DR1 and DR2 apply differentvoltages through the first and second ends of the interconnects when thekick operation is performed on the word line WL.

Specifically, the semiconductor memory device 10 according to the fourthembodiment executes control during the kick operation on the word lineWL, for example, in such a manner that the BLC driver DR applying thecontrol signal BLC from the Near side performs the kick operation,whereas the BLC driver DR applying the control signal BLC from the Farside does not perform the kick operation.

Consequently, as is the case with the first to third embodiments, thesemiconductor memory device 10 according to the fourth embodiment canadjust the amount of kick in the control signal BLC in keeping with avariation in the amount of kick on the word line WL according to thedistance from the row decoder module 12. Therefore, as is the case withthe first to third embodiments, the semiconductor memory device 10according to the fourth embodiment can reduce the stabilization time forthe voltage of each bit line BL when the kick operation is performed,enabling an increase in the speed of the read operation.

[5] Fifth Embodiment

The semiconductor memory device 10 according to a fifth embodimentcontrols the control signal BLC for each set area when the row decodermodules 12A and 12B drive each block BLK from the respective oppositesides of the block. The semiconductor memory device 10 according to thefifth embodiment will be described in conjunction with differences fromthe first to fourth embodiments.

[5-1] Configuration

FIG. 25 is a block diagram illustrating a configuration example of thememory cell array 11 and the row decoder module 12 included in thesemiconductor memory device 10 according to the fifth embodiment. Theconfiguration in FIG. 25 is different from the configuration describedin the second embodiment using FIG. 15 in the configuration of the rowdecoder modules 12A and 12B.

Specifically, the row decoder module 12A according to the fifthembodiment includes the row decoder RDA corresponding to the blocks BLK0to BLKn, and the row decoder module 12B according to the fifthembodiment includes the row decoder RDB corresponding to the blocks BLK0to BLKn. In other words, the blocks BLK according to the fifthembodiment are driven from the opposite sides thereof by the row decodermodules 12A and 12B. Specifically, the row decoder RDA supplies avoltage to the block BLK through a first end of the conductor 42corresponding to the word line WL, and the row decoder RDB supplies avoltage to the block BLK through a second end of the conductor 42. Areasof each block BLK located near the row decoders RDA and RDB arehereinafter referred to as “Edges”. An area of each block BLK whichincludes a central portion thereof is hereinafter referred to as a“Center”. In other words, the areas AR1 and AR2 correspond to the Edgeportions, and the area AR3 corresponds to the Center portion.

FIG. 26 is a block diagram illustrating a detailed configuration exampleof the sense amplifier module 13 and the voltage generator 19 includedin the semiconductor memory device 10 according to the fifth embodiment.The configuration in FIG. 26 is different from the configurationdescribed in the second embodiment using FIG. 15 in that the BLC driverDR3 is omitted and that the BLC drivers DR1 and DR2 have a differentconnection relationship with each sense amplifier segment SEG.

Specifically, as illustrated in FIG. 26 , in the fifth embodiment, theBLC driver DR1 supplies the generated control signal BLC1 to the senseamplifier units SAU included in the segments SEG1 and SEG2, and the BLCdriver DR2 supplies the generated control signal BLC2 to the senseamplifier units SAU included in the segments SEG3. The remaining part ofthe configuration of the semiconductor memory device 10 according to thefifth embodiment is similar to the corresponding part of theconfiguration of the semiconductor memory device 10 according to thefirst embodiment, and will thus not be described below.

[5-2] Operations

The semiconductor memory device 10 according to the fifth embodiment,for example, performs the kick operation on the control signal BLC1 anddoes not perform the kick operation on the control signal BLC2 when thekick operation is performed on the word line WL in the read operation.

FIG. 27 illustrates examples of waveforms obtained in the read operationof the semiconductor memory device 10 according to the fifth embodiment.FIG. 27 illustrates the waveforms for portions of the word line WL inthe Center and Edge portions, the waveforms of the control signals BLC1and BLC2, and the waveform of the control signal STB.

As illustrated in FIG. 27 , the waveform for the portion of the wordline WL in the Center portion and the waveform of the control signalBLC1 are similar to the waveform for the Near side of the word line WLand the waveform of the control signal BLC1 described in the firstembodiment using FIG. 12 , and the waveform for the portion of the wordline WL in the Edge portion and the waveform of the control signal BLC2are similar to the waveform for the Far side of the word line WL and thewaveform of the control signal BLC2 described in the first embodimentusing FIG. 12 . In other words, the sequencer 17 controls the controlsignal BLC for the sense amplifier segments SEG1 and SEG2 correspondingto the Edge portion as is the case with the Near side described in thefirst embodiment, and controls the control signal BLC for the senseamplifier segment SEG3 as is the case with the Far side described in thefirst embodiment. The other operations of the semiconductor memorydevice 10 according to the fifth embodiment are similar to thecorresponding operations of the semiconductor memory device 10 accordingto the first embodiment, and will thus not be described below.

[5-3] Effects of the Fifth Embodiment

As described above, the semiconductor memory device 10 according to thefifth embodiment is configured in such a manner that the word line WL isdriven from the opposite sides thereof by the row decoder modules 12Aand 12B. When the word line WL is driven from the opposite sidesthereof, for example, the waveforms for the portions of the word line WLin the two Edge portions illustrated in FIG. 25 are similar to thewaveform for the Near side of the word line WL described in the firstembodiment, and the waveform for the portion of the word line WL in theCenter portion illustrated in FIG. 25 is similar to the waveform for theFar side of the word line WL described in the first embodiment.

Thus, to perform the kick operation on the word line WL, thesemiconductor memory device 10 according to the fifth embodimentcontrols the control signal BLC corresponding to the Edge portion as isthe case with the Near side described in the first embodiment, andcontrols the control signal BLC corresponding to the Center portion asis the case with the Far side described in the first embodiment.

Consequently, the semiconductor memory device 10 of the fifth embodimentcan optimize the amount of kick in the control signal BLC in the Edgeportion and in the Center portion, enabling a reduction in thestabilization time for the voltage of each bit lines BL0. Therefore, asis the case with the first embodiment, the semiconductor memory device10 according to the fifth embodiment can increase the speed of the readoperation.

By way of example, the case has been described where, when the kickoperation is performed on the word line WL, the kick operation is notperformed on the control signal BLC2 for the Center portion. However,the present invention is not limited to this. For example, the sequencer17 may also perform the kick operation on the control signal BLC2, andthe amount of kick in the control signal BLC2 corresponding to theCenter portion may be smaller than the amount of kick in the controlsignal BLC1 corresponding to the Edge portion. Even in such a case, thesemiconductor memory device 10 according to the fifth embodiment canproduce the above-described effects.

[6] Sixth Embodiment

The semiconductor memory device 10 according to a sixth embodimentrelates to a configuration example of the sense amplifier module 13which varies the amount of kick according to the first to fifthembodiments. The semiconductor memory device 10 according to the sixthembodiment will be described in conjunction with differences from thefirst to fifth embodiments.

[6-1] Configuration

FIG. 28 illustrates a configuration example of the sense amplifiermodule 13 included in the semiconductor memory device according to thesixth embodiment, and illustrates an example of a circuit configurationof one sense amplifier unit SAU. As illustrated in FIG. 28 , theconfiguration of the sense amplifier unit SAU according to the sixthembodiment is different, in the configuration of the sense amplifierportion SA, from the configuration of the sense amplifier unit SAUdescribed in the first embodiment using FIG. 6 .

Specifically, the sense amplifier module 13 according to the sixthembodiment includes transistors 22A and 22B. The transistors 22A and 22Bare connected in parallel between the node COM and the corresponding bitline BL. A control signal BLCa is input to a gate of the transistor 22A,and a control signal BLCb is input to a gate of the transistor 22B. Inother words, the sense amplifier portion SA includes the plurality oftransistors connected in parallel and which can be independentlycontrolled by the sequencer 17.

Among the plurality of transistors 22 connected in parallel, forexample, any one transistor corresponds to a transistor used for normaloperations, and the other transistors correspond to transistors usedonly during the kick operation. However, the present invention is notlimited to this, and the plurality of transistors connected in parallelmay be used for normal operations.

[6-2] Operations

For the sense amplifier unit SAU according to the sixth embodiment, thesequencer 17 controls the transistors 22A and 22B to vary the amount ofkick. FIG. 29 illustrates an example of a control method for thetransistors 22A and 22B according to the sixth embodiment.

As illustrated in FIG. 29 , to increase the amount of kick, thesequencer 17, for example, brings both the control signals BLCa and BCLbto the “H” level to set the transistors 22A and 22B to the on state.Then, the amount of current flowing between the node COM and thecorresponding bit line BL decreases to reduce a charging speed for thebit line BL. The other operations of the semiconductor memory device 10according to the sixth embodiment are similar to the correspondingoperations of the semiconductor memory device 10 according to the firstembodiment, and will thus not be described below.

[6-3] Effects of the Sixth Embodiment

As described above, the sense amplifier module 13 according to the sixthembodiment can adjust the amount of kick in the control signal BLC in adetailed manner during the kick operation on the word line WL.

For example, the optimal amount of kick in the control signal BLC mayvary according to the position of the selected memory cell transistorMT. Thus, the semiconductor memory device 10 according to the sixthembodiment varies the amount of kick in the control signal BLC byvarying the control of the transistors 22A and 22B in the senseamplifier unit SAU based on the address of the selected memory celltransistor MT.

Consequently, the semiconductor memory device 10 according to the sixthembodiment can apply the optimal amount of kick to the control signalBLC during various operations.

[7] Modifications and the Like

The semiconductor memory device 10 according to the embodiments includesthe first and second memory cells <MT, FIG. 2 >, the first word line<WL, FIG. 2 >, the first and second sense amplifiers <SAU, FIG. 5 >, thefirst and second bit lines <BL, FIG. 2 >, and the controller <17, FIG.1 >. The first word line WL is connected to the first and second memorycells. The first and second sense amplifiers include the first andsecond transistors <22, FIG. 6 >, respectively. The first bit line isconnected between the first memory cell and the first transistor. Thecontroller performs the read operation. In the read operation, thecontroller applies the kick voltage <CR+CGkick, FIG. 12 > higher thanthe read voltage to the first word line before applying the read voltageto the first word line, and applies a first voltage <Vb1 c+BLkick, FIG.12 > to the gate of the first transistor and a second voltage <:Vb1 c,FIG. 12 > lower than the first voltage to the gate of the secondtransistor, while applying the kick voltage to the first word line.Consequently, a semiconductor memory device which can operate fast canbe provided.

In the above-described embodiments, the case where the lower readvoltage is first applied in the read operation has been described by wayof example. However, the present invention is not limited to this. Forexample, as illustrated in FIG. 30 , the higher read voltage may firstbe applied, and a threshold voltage for the memory cell transistor MTmay be determined. FIG. 30 illustrates examples of waveforms obtained inthe read operation of the semiconductor memory device 10 according to amodification of the first embodiment. FIG. 30 illustrates the waveformsfor the selected word line WL, the control signal BLC1 corresponding tothe Near side, the control signal BLC2 corresponding to the Far side,and the control signal STB.

As illustrated in FIG. 30 , the row decoder module 12 applies the readvoltage CR to the selected word line WL at the time t0, and applies theread voltage AR to the selected word line WL at the time t1. With thekick operation being performed, before the read voltage CR is provided,a voltage higher than the read voltage CR by an amount equal to thevoltage CGkick is temporarily applied to the Near side of the word lineWL. On the other hand, on the Far side of the word line WL, the readvoltage CR is directly reached due to the effect of an RC time constant.The control signal BLC1 corresponding to the Near side performs the kickoperation when the read voltage CR is applied to the word line WL. Thecontrol signal BLC2 corresponding to the Far side does not perform thekick operation when the read voltage CR is applied to the word line WL.When each read voltage is applied and the control signal STB is thenasserted, the sense amplifier unit SAU determines the threshold voltagefor the memory cell transistor MT. At the time t3, the read operationends. In this manner, the above-described embodiments are applicable toany cases where the kick operation is performed on the word line WL.

In the above-described embodiments, the case where the execution of theread operation is intended for all the bit lines BL has been describedby way of example. However, the present invention is not limited tothis. For example, the semiconductor memory device 10 may be configuredin such a manner that the read operation may be divisively performed forthe odd-numbered bit lines and for the even-numbered bit lines. In thiscase, two sense amplifier modules 13 are provided, for example, inassociation with a set of the odd-numbered bit lines and a set of theeven-numbered bit lines, respectively. The sense amplifier modules 13corresponding to the set of odd-numbered bit lines and the set ofeven-numbered bit lines, respectively, are provided, for example, withdifferent control signals BLC. The above-described embodiments are alsoapplicable to the semiconductor memory device 10 configured as describedabove.

By way of example, the read operation for upper page data has beendescribed in the embodiments. However, the present invention is notlimited to this. For example, the operations described in theembodiments are also applicable to a read operation for lower page data.Furthermore, by way of example, the case where data of 2 bits is storedin one memory cell has been described in the embodiments. However, thepresent invention is not limited to this. For example, data of 1 bit or3 or more bits may be stored in one memory cell. Even in such a case,the read operation described in the first to sixth embodiments can beperformed.

In the above-described embodiments, the case has been described wherethe voltage applied to the word line WL in the kick operation and theamount of kick in the voltage corresponding to the control signal BLCare approximately constant, by way of example. However, the presentinvention is not limited to this. For example, the voltages may bevaried based on the address of the selected word line WL. Specifically,when the memory cells include a three-dimensionally stacked structure,for example, the RC time constant may vary between a set of the wordlines WL in the upper layer and a set of the word lines WL in the lowerlayer, leading to the appropriate amount of kick varying between thesets. In such a case, the semiconductor memory device 10 can increasethe speed of the read operation by applying optimized amounts of kick tothe different sets of the word lines WL in the respective layers.

By way of example, the case where the row decoder module 12 is providedbelow the memory cell array 11 has been described in the embodiments.However, the present invention is not limited to this. For example, thememory cell array 11 may be formed on the semiconductor substrate, andthe row decoder modules 12A and 12B may be arranged opposite torespective ends of memory cell array 11. Even in such a case, theoperations described in the embodiments can be performed.

By way of example, the case where the semiconductor memory device 10reads data on a page by page basis has been described in theembodiments. However, the present invention is not limited to this. Forexample, the semiconductor memory device 10 may read data of a pluralityof bits stored in the memory cells at the same time. Even in such acase, the kick operation may be applied when the read operation isperformed, and thus, the semiconductor memory device 10 can apply theoperations described in the embodiments.

In the above-described embodiments, the read operation has beendescribed using the timing charts illustrating the waveform for the wordline WL. The waveform for the word line WL is, for example, similar tothe waveform for a signal line through which voltages are supplied tothe row decoder module 12. In other words, the voltage applied to theword line WL and the period when the voltage is applied to the word lineWL according to the above-described embodiments can be roughly known bychecking the voltage of the corresponding signal line. The voltage ofthe word line WL may be lower than the voltage of the correspondingsignal line due to a voltage drop caused by a transfer transistorincluded in the row decoder module 12.

By way of example, the case where MONOS films are used for the memorycells has been described in the embodiments. However, the presentinvention is not limited to this. For example, even when memory cellscomprising floating gates are used, similar effects can be produced byperforming the read operation and the write operation described in theembodiments.

In the above-described embodiments, the case has been described wherethe via contact VC to which each conductor 42 is electrically connectedextends through the conductors 42, by way of example. However, thepresent invention is not limited to this. For example, the via contactVC corresponding to each conductor 42 may extend from a conductor 42 ina different interconnect layer through the conductor 40 and may beconnected to the corresponding diffusion area 52. By way of example, thecase has been described where the via contacts BC, VC, HU, and TRC areeach formed of a pillar in a single stage. However, the presentinvention is not limited to this. For example, each of these viacontacts may be formed by coupling two or more pieces of a pillartogether in stages. The two or more pieces of the pillar may be coupledtogether in stages via different conductors.

In the above-described embodiments, the memory cell array 11 may includea different configuration. Another configuration of the memory cellarray 11 is described, for example, in U.S. patent application Ser. No.12/407,403 entitled “Three-dimensionally Stacked Non-volatileSemiconductor Memory” filed on Mar. 19, 2009. Other configurations aredescribed in U.S. patent application Ser. No. 12/406,524 entitled“Three-dimensionally Stacked Non-volatile Semiconductor Memory” filed onMar. 18, 2009, U.S. patent application Ser. No. 12/679,991 entitled“Non-volatile Semiconductor Memory Device and Manufacturing Methodtherefor” filed on Mar. 25, 2010, and U.S. patent application Ser. No.12/532,030 entitled “Semiconductor Memory and Manufacturing Methodtherefor” filed on Mar. 23, 2009. These patent applications areincorporated by reference herein in their entirety.

The block BLK is, for example, an erase unit of data in thethree-dimensional semiconductor memory device, but is not limitedthereto. Other erase operations are described in U.S. patent applicationSer. No. 13/235,389 entitled “Nonvolatile semiconductor memory device”filed on Sep. 18, 2011, and in U.S. patent application Ser. No.12/694,690 entitled “Non-volatile semiconductor memory device” filed onJan. 27, 2010. These patent applications are incorporated by referenceherein in their entirety.

The “connection” as used herein refers to electric connection and doesnot exclude interposition of another element between connected elements.The “cutoff” as used herein refers to the off state of a switch ofinterest and does not exclude flow of a microcurrent, for example, aleakage current from a transistor.

The “read operation” as used herein is not limited to the operation ofreading data stored in the memory cell array 11 based on an indicationfrom an external memory controller (hereinafter referred to as a normalread operation). For example, the “read operation” described in theembodiments can be applied to a verify operation in the write operationand a verify operation in an erase operation. The verify operation inthe write operation is a read operation of checking whether thethreshold voltage of the memory cell transistor MT is at or higher thanthe desired threshold voltage as a result of progress of the writeoperation. The verify operation in the erase operation is a readoperation of checking whether the threshold voltage of the memory celltransistor MT has transitioned to an erase state (an “ER level”) as aresult of the erase operation.

Specifically, the semiconductor memory device 10 can perform, even inthe verify operation, operations similar to those in the above-describedembodiments by replacing the read voltage described in the embodimentswith a verify voltage set for each verify operation. Such a verifyoperation may involve a different read operation and a different amountof voltage transitioned on the word line WL. Thus, in the verifyoperation, the amount of kick in the control signal BLC applied to theNear side and the amount of kick in the control signal BLC applied tothe Far side may be set to values different from those used for thenormal operation.

In the embodiments according to the present invention:

(1) The voltage applied to the word line selected for the read operationat the “A”-level may be, for example, 0 V to 0.55 V. The voltage is notlimited thereto, and may be 0.1 V to 0.24 V, 0.21 V to 0.31 V, 0.31 V to0.4 V, 0.4 V to 0.5 V, or 0.5 V to 0.55 V.

The voltage applied to the word line selected for the read operation atthe “B”-level is, for example, 1.5 V to 2.3 V. The voltage is notlimited thereto, and may be 1.65 V to 1.8 V, 1.8 V to 1.95 V, 1.95 V to2.1 V, or 2.1 V to 2.3 V.

The voltage applied to the word line selected for the read operation atthe “C”-level is, for example, 3.0 V to 4.0 V. The voltage is notlimited thereto, and may be 3.0 V to 3.2 V, 3.2 V to 3.4 V, 3.4 V to 3.5V, 3.5 V to 3.6 V, or 3.6 V to 4.0 V.

The time (tR) for the read operation may be, for example, 25 μs to 38μs, 38 μs to 70 μs, or 70 μs to 80 μs.

(2) The write operation includes the program operation and theverification operation as described above. In the write operation, thevoltage first applied to the word line selected for the programoperation may be, for example, 13.7 V to 14.3 V. The voltage is notlimited thereto, and may be 13.7 V to 14.0 V or 14.0 V to 14.6 V.

The voltage first applied to the selected word line in the writing intoan odd word line, and the voltage first applied to the selected wordline in the writing into an even word line may be changed.

When the program operation is an incremental step pulse program (ISPP)type, a step-up voltage is, for example, about 0.5.

The voltage applied to the unselected word line may be, for example, 6.0V to 7.3 V. The voltage is not limited thereto, and may be, for example,7.3 V to 8.4 V or may be 6.0 V or less.

The pass voltage to be applied may be changed depending on whether theunselected word line is an odd word line or an even word line.

The time (tProg) for the write operation may be, for example, 1700 μs to1800 μs, 1800 μs to 1900 μs, or 1900 μs to 2000 μs.

(3) In the erase operation, the voltage first applied to a well which isformed on the semiconductor substrate and over which the memory cellsare arranged may be, for example, 12 V to 13.6 V. The voltage is notlimited thereto, and may be, for example, 13.6 V to 14.8 V, 14.8 V to19.0 V, 19.0 to 19.8 V, 19.8 V to 21 V.

The time (tErase) for the erase operation may be, for example, 3000 μsto 4000 μs, 4000 μs to 5000 μs, or 4000 μs to 9000 μs.

(4) The structure of the memory cell may have the charge storage layerdisposed on the semiconductor substrate (silicon substrate) via a tunnelinsulating film having a thickness of 4 to 10 nm. This charge storagelayer may have a stacked structure including an insulating film of SiNor SiON having a thickness of 2 to 3 nm and polysilicon having athickness of 3 to 8 nm. A metal such as Ru may be added to polysilicon.An insulating film is provided on the charge storage layer. Thisinsulating film has, for example, a silicon oxide film having athickness of 4 to 10 nm intervening between a lower high-k film having athickness of 3 to 10 nm and an upper high-k film having a thickness of 3to 10 nm. The high-k film includes, for example, HfO. The silicon oxidefilm can be greater in thickness than the high-k film. A controlelectrode having a thickness of 30 to 70 nm is formed on the insulatingfilm via a material for work function adjustment having a thickness of 3to 10 nm. Here, the material for work function adjustment includes ametal oxide film such as TaO or a metal nitride film such as TaN. W, forexample, can be used for the control electrode.

An air gap can be formed between the memory cells.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A semiconductor memory device comprising: a firstmemory cell and a second memory cell; a first word line connected to thefirst memory cell; a second word line connected to the second memorycell; a first sense amplifier and a second sense amplifier including afirst transistor and a second transistor, respectively; a first bit lineconnected between the first memory cell and the first transistor; asecond bit line connected between the second memory cell and the secondtransistor; and a controller configured to perform a first readoperation and a second read operation, wherein the controller is furtherconfigured to apply a first voltage to a gate of the first transistor inthe first read operation, and a second voltage lower than the firstvoltage to a gate of the second transistor in the second read operation.2. The device of claim 1, wherein the controller is further configuredto apply, in the first read operation, a third voltage higher than aread voltage to the first word line before applying the read voltage tothe first word line, while applying the first voltage to the gate of thefirst transistor.
 3. The device of claim 2, wherein the controller isfurther configured to apply, in the first read operation, the secondvoltage to the gate of the first transistor while applying the readvoltage to the first word line.
 4. The device of claim 1, wherein thecontroller is further configured to apply, in the first read operation,the second voltage to the gate of the first transistor after applyingthe first voltage to the gate of the first transistor.
 5. The device ofclaim 1, wherein the second memory cell is included in a block differentfrom a block including the first memory cell.
 6. The device of claim 1,further comprising: a first conductor provided to extend in a firstdirection and to function as the first word line; a second conductorprovided to extend in the first direction and to function as the secondword line; a first pillar provided to extend through the first conductorin a second direction, an intersection between the first pillar and thefirst conductor functioning as the first memory cell; a second pillarprovided to extend through the second conductor in the second direction,an intersection between the second pillar and the second conductorfunctioning as the second memory cell; and a third pillar provided onthe first conductor and electrically connected to the first conductor; afourth pillar provided on the second conductor and electricallyconnected to the second conductor.
 7. The device of claim 6, wherein aspacing between the third pillar and the first pillar in the firstdirection is shorter than a spacing between the fourth pillar and thesecond pillar in the first direction.
 8. The device of claim 6, whereinthe first conductor and the second conductor are separated from eachother in a third direction crossing the first direction and the seconddirection.
 9. The device of claim 6, wherein the controller is furtherconfigured to apply a voltage to the first word line via the thirdpillar, and the voltage is applied to the first word line from one sidein the first direction.
 10. The device of claim 9, wherein thecontroller is further configured to apply a voltage to the second wordline via the fourth pillar, and the voltage is applied to the secondword line from another side in the first direction.
 11. A semiconductormemory device comprising: a first memory cell and a second memory cell;a first word line connected to the first memory cell; a second word lineconnected to the second memory cell; a first sense amplifier including afirst transistor; a first bit line connected to the first memory cell,the second memory cell and the first transistor; and a controllerconfigured to perform a first read operation and a second readoperation, wherein the controller is further configured to apply a firstvoltage to a gate of the first transistor in the first read operation,and a second voltage lower than the first voltage to a gate of the firsttransistor in the second read operation.
 12. The device of claim 11,wherein the controller is further configured to apply, in the first readoperation, a third voltage higher than a read voltage to the first wordline before applying the read voltage to the first word line, whileapplying the first voltage to the gate of the first transistor.
 13. Thedevice of claim 12, wherein the controller is further configured toapply, in the first read operation, the second voltage to the gate ofthe first transistor while applying the read voltage to the first wordline.
 14. The device of claim 11, wherein the controller is furtherconfigured to apply, in the first read operation, a third voltage lowerthan the first voltage to the gate of the first transistor afterapplying the first voltage to the gate of the first transistor.
 15. Thedevice of claim 11, wherein the second memory cell is included in ablock different from a block including the first memory cell.
 16. Thedevice of claim 11, further comprising: a first conductor provided toextend in a first direction and to function as the first word line; asecond conductor provided to extend in the first direction and tofunction as the second word line; a first pillar provided to extendthrough the first conductor in a second direction, an intersectionbetween the first pillar and the first conductor functioning as thefirst memory cell; a second pillar provided to extend through the secondconductor in the second direction, an intersection between the secondpillar and the second conductor functioning as the second memory cell;and a third pillar provided on the first conductor and electricallyconnected to the first conductor; a fourth pillar provided on the secondconductor and electrically connected to the second conductor.
 17. Thedevice of claim 16, wherein a spacing between the third pillar and thefirst pillar in the first direction is shorter than a spacing betweenthe fourth pillar and the second pillar in the first direction.
 18. Thedevice of claim 16, wherein the first conductor and the second conductorare separated from each other in a third direction crossing the firstdirection and the second direction.
 19. The device of claim 16, whereinthe controller is further configured to apply a voltage to the firstword line via the third pillar, and the voltage is applied to the firstword line from one side in the first direction.
 20. The device of claim19, wherein the controller is further configured to apply a voltage tothe second word line via the fourth pillar, and the voltage is appliedto the second word line from another side in the first direction.